Backgrind Tape×KGK 共同技研化学 - メーカー・企業と製品の一覧

Back grind tape

Back grinding protective tape for semiconductor wafers

Back grind tape is used to protect the circuit surface from contamination such as scratches, chipping, cracks, and contamination caused by external foreign substances during the back grinding of the wafer's backside. - Excellent adhesion to uneven wafers such as circuit surfaces - Excellent peelability

• 企業：KGK 共同技研化学 埼玉県所沢本社・工場、群馬県富岡工場、東京都池袋事業所
• 価格：Other

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